array(66) {
["id"]=>
string(1) "3"
["pdf_add"]=>
string(75) "http://www.ixysic.com/home/pdfs.nsf/www/CPC5620_21.pdf/$file/CPC5620_21.pdf"
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(54) "//media.digikey.com/Renders/Clare%20Renders/CPC562.jpg"
["images"]=>
string(74) "https://www.chenkeiot.com/Public/imagesmk/Renders/Clare_Renders/CPC562.jpg"
["ljbh"]=>
string(11) "CLA321TR-ND"
["zzsbh"]=>
string(10) "CPC5621ATR"
["zddgs"]=>
string(4) "1000"
["xysl"]=>
string(4) "1000"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(27) "IC TELECOM INTERFACE 32SOIC"
["xl"]=>
string(14) "LITELINK® III"
["zzs"]=>
string(14) "IXYS/艾赛斯"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(33) "IXYS Integrated Circuits Division"
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["gn"]=>
string(27) "数据存取装置(DAA)"
["jk"]=>
string(1) "-"
["dls"]=>
string(1) "1"
["dydy"]=>
string(9) "3V ~ 5.5V"
["dldy"]=>
string(3) "9mA"
["gl"]=>
string(3) "1 W"
["gzwd"]=>
string(14) "-40°C ~ 85°C"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(18) "32-SOIC(7.50mm宽)"
["gysqjfz"]=>
string(7) "32-SOIC"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "1000"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "30"
["wl_num"]=>
string(4) "1086"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_dx"
["ch_bm"]=>
string(18) "电信接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
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select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.rate,a.rate_hot,sum(a.rate+a.rate_hot/100) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx'
封装:32-SOIC
外壳:32-SOIC(7.50mm宽)
描述:
IC TELECOM INTERFACE 32SOIC
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系列:LITELINK® III
功能:数据存取装置(DAA)
接口:-
电路数:1
电压-电源输入(v):3V ~ 5.5V
电流-电源输出(a):9mA
功率(w):1 W
工作温度(°C):-40°C ~ 85°C
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string(46) "'xl','gn','jk','dls','dydy','dldy','gl','gzwd'"
SELECT COLUMN_NAME as bt,COLUMN_COMMENT as title FROM INFORMATION_SCHEMA.Columns WHERE ORDINAL_POSITION >=(SELECT ORDINAL_POSITION FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_jk_dx' AND table_schema='golon' and COLUMN_NAME='ms')+1 and ORDINAL_POSITION <=(SELECT ORDINAL_POSITION FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_jk_dx' AND table_schema='golon' and COLUMN_NAME='is_new_time') and table_name='golon_jk_dx' AND table_schema='golon' and COLUMN_NAME not in('tdxl','gysqjfz','lm','fz_wk','zzs','tag','wk_cc','zzs_old','zzs_new','ljzt','spq','sqp','is_rohs','bz','gys_id','gm_gys_id','xysl','cfkc','dj','price_addtime','zddgs','spq','moq''gl_zz','gl_dm','gl_dmtp','symbol','gl_vdd','gl_gnd','gl_jz','gl_bdm','gl_bdmsm','gl_kbc','gl_dmgx','pcbfzk_id','pcbfzk','jyid','cat_id','wl_num','admin_id','mpn_bm','ch_bm','lock_dm','is_use_cat_id','is_new_time','gl_zz','gl_pin') and COLUMN_NAME not in ('xl','gn','jk','dls','dydy','dldy','gl','gzwd') limit 8
安装类型:表面贴装型
元器件等级:-
最小起订MOQ:5
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