array(69) {
["id"]=>
string(2) "12"
["pdf_add"]=>
string(76) "http://www.atmel.com/Images/Atmel-8884S-TPM-AT97SC3205-Datasheet-Summary.pdf"
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(83) "//media.digikey.com/Renders/Microchip%20Tech%20Renders/32-VFQFN%20Exposed%20Pad.jpg"
["images"]=>
string(97) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microchip_Tech_Renders/32-VFQFN_Exposed_Pad.jpg"
["ljbh"]=>
string(22) "AT97SC3205-H3M4500B-ND"
["zzsbh"]=>
string(19) "AT97SC3205-H3M4500B"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(3) "977"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["jmgys_id"]=>
NULL
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(29) "PRODFF IND SPI TPM 4X4 32VQFN"
["xl"]=>
string(0) ""
["zzs"]=>
string(16) "Microchip/微芯"
["zzs_new"]=>
string(16) "Microchip/微芯"
["zzs_old"]=>
string(20) "Microchip Technology"
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(27) "信任平台模块（TPM）"
["hxclq"]=>
string(3) "AVR"
["ccqlx"]=>
string(6) "EEPROM"
["kzqxl"]=>
string(1) "-"
["ram_rl"]=>
string(1) "-"
["jk"]=>
string(3) "SPI"
["io_num"]=>
string(1) "4"
["dydy"]=>
string(4) "3.3V"
["gzwd"]=>
string(14) "-40°C ~ 85°C"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(21) "32-VFQFN 裸露焊盘"
["gysqjfz"]=>
string(16) "32-VQFN（4x4）"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "托盘"
["spq"]=>
string(3) "490"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(6) "1,8,22"
["gl_gnd"]=>
string(9) "2,9,23,32"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "1"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "9"
["wl_num"]=>
string(4) "1066"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(19) "golon_qrs_wkzq_yytd"
["ch_bm"]=>
string(20) "微控制器(特定)"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
NULL
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
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select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.rate,a.rate_hot,sum(a.rate+a.rate_hot/100) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_wkzq_yytd'
封装：32-VQFN（4x4）
外壳：32-VFQFN 裸露焊盘
描述：
PRODFF IND SPI TPM 4X4 32VQFN
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系列：
核心处理器：AVR
程序处理器：EEPROM
ram容量：-
接口：SPI
i/o数：4
输入电压-电源(v)：3.3V
工作温度：-40°C ~ 85°C
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string(57) "'xl','hxclq','ccqlx','ram_rl','jk','io_num','dydy','gzwd'"
SELECT COLUMN_NAME as bt,COLUMN_COMMENT as title FROM INFORMATION_SCHEMA.Columns WHERE ORDINAL_POSITION >=(SELECT ORDINAL_POSITION FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_qrs_wkzq_yytd' AND table_schema='golon' and COLUMN_NAME='ms')+1 and ORDINAL_POSITION <=(SELECT ORDINAL_POSITION FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_qrs_wkzq_yytd' AND table_schema='golon' and COLUMN_NAME='is_new_time') and table_name='golon_qrs_wkzq_yytd' AND table_schema='golon' and COLUMN_NAME not in('tdxl','gysqjfz','lm','fz_wk','zzs','tag','wk_cc','zzs_old','zzs_new','ljzt','spq','sqp','is_rohs','bz','gys_id','gm_gys_id','xysl','cfkc','dj','price_addtime','zddgs','spq','moq''gl_zz','gl_dm','gl_dmtp','symbol','gl_vdd','gl_gnd','gl_jz','gl_bdm','gl_bdmsm','gl_kbc','gl_dmgx','pcbfzk_id','pcbfzk','jyid','cat_id','wl_num','admin_id','mpn_bm','ch_bm','lock_dm','is_use_cat_id','is_new_time','gl_zz','gl_pin') and COLUMN_NAME not in ('xl','hxclq','ccqlx','ram_rl','jk','io_num','dydy','gzwd') limit 8
应用：信任平台模块（TPM）
控制器系列：-
安装类型：表面贴装型
元器件等级：-
最小起订MOQ：10
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