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array(69) { ["id"]=> string(2) "29" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(18) "M2GL090-FGG484I-ND" ["zzsbh"]=> string(15) "M2GL090-FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "86184" ["zram_ws"]=> string(7) "2648064" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL090-FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 29 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：86184
总ram位数：2648064
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：107429
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL090-FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(3) "358" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(19) "M2GL090T-FGG484I-ND" ["zzsbh"]=> string(16) "M2GL090T-FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "86184" ["zram_ws"]=> string(7) "2648064" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL090T-FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 358 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：86184
总ram位数：2648064
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：1074358
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL090T-FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(3) "360" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "M2GL090TS-1FGG484-ND" ["zzsbh"]=> string(17) "M2GL090TS-1FGG484" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "86184" ["zram_ws"]=> string(7) "2648064" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL090TS-1FGG484复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 360 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：86184
总ram位数：2648064
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：1074360
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL090TS-1FGG484' ) LIMIT 1
array(69) { ["id"]=> string(3) "362" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(19) "M2GL090TS-FGG484-ND" ["zzsbh"]=> string(16) "M2GL090TS-FGG484" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "86184" ["zram_ws"]=> string(7) "2648064" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL090TS-FGG484复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 362 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：86184
总ram位数：2648064
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：1074362
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL090TS-FGG484' ) LIMIT 1
array(69) { ["id"]=> string(3) "385" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "M2GL090TS-FGG484I-ND" ["zzsbh"]=> string(17) "M2GL090TS-FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "86184" ["zram_ws"]=> string(7) "2648064" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL090TS-FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 385 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：86184
总ram位数：2648064
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：1074385
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL090TS-FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(3) "612" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "M2GL050TS-FGG484I-ND" ["zzsbh"]=> string(17) "M2GL050TS-FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(5) "56340" ["ljyj_dys"]=> string(7) "1869824" ["zram_ws"]=> string(3) "267" ["io_num"]=> string(3) "267" ["sjs"]=> string(0) "" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL050TS-FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 612 ) LIMIT 1
系列：IGLOO2
lab/clb数：56340
逻辑元件/单元数：1869824
总ram位数：267
i/o 数：267
栅极数：
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：1074612
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL050TS-FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(3) "634" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "M2GL060T-1FGG484I-ND" ["zzsbh"]=> string(17) "M2GL060T-1FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "56520" ["zram_ws"]=> string(7) "1869824" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL060T-1FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 634 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：56520
总ram位数：1869824
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：1074634
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL060T-1FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(3) "636" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(19) "M2GL060T-FGG484I-ND" ["zzsbh"]=> string(16) "M2GL060T-FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "56520" ["zram_ws"]=> string(7) "1869824" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL060T-FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 636 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：56520
总ram位数：1869824
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：1074636
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL060T-FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(3) "638" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "M2GL060TS-1FGG484-ND" ["zzsbh"]=> string(17) "M2GL060TS-1FGG484" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "56520" ["zram_ws"]=> string(7) "1869824" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL060TS-1FGG484复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 638 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：56520
总ram位数：1869824
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：1074638
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL060TS-1FGG484' ) LIMIT 1
array(69) { ["id"]=> string(3) "640" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(19) "M2GL060TS-FGG484-ND" ["zzsbh"]=> string(16) "M2GL060TS-FGG484" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "56520" ["zram_ws"]=> string(7) "1869824" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL060TS-FGG484复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 640 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：56520
总ram位数：1869824
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：1074640
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL060TS-FGG484' ) LIMIT 1
array(69) { ["id"]=> string(3) "648" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "M2GL050TS-1FGG484-ND" ["zzsbh"]=> string(17) "M2GL050TS-1FGG484" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(5) "56340" ["ljyj_dys"]=> string(7) "1869824" ["zram_ws"]=> string(3) "267" ["io_num"]=> string(3) "267" ["sjs"]=> string(0) "" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL050TS-1FGG484复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 648 ) LIMIT 1
系列：IGLOO2
lab/clb数：56340
逻辑元件/单元数：1869824
总ram位数：267
i/o 数：267
栅极数：
电压-电源(v)：1.14V ~ 2.625V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：1074648
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL050TS-1FGG484' ) LIMIT 1
array(69) { ["id"]=> string(3) "650" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(19) "M2GL050TS-FGG484-ND" ["zzsbh"]=> string(16) "M2GL050TS-FGG484" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(5) "56340" ["ljyj_dys"]=> string(7) "1869824" ["zram_ws"]=> string(3) "267" ["io_num"]=> string(3) "267" ["sjs"]=> string(0) "" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL050TS-FGG484复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 650 ) LIMIT 1
系列：IGLOO2
lab/clb数：56340
逻辑元件/单元数：1869824
总ram位数：267
i/o 数：267
栅极数：
电压-电源(v)：1.14V ~ 2.625V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：1074650
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL050TS-FGG484' ) LIMIT 1
array(69) { ["id"]=> string(3) "776" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(21) "M2GL060TS-1FGG484I-ND" ["zzsbh"]=> string(18) "M2GL060TS-1FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "56520" ["zram_ws"]=> string(7) "1869824" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL060TS-1FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 776 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：56520
总ram位数：1869824
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：1074776
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL060TS-1FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(3) "778" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "M2GL060TS-FGG484I-ND" ["zzsbh"]=> string(17) "M2GL060TS-FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "56520" ["zram_ws"]=> string(7) "1869824" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL060TS-FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 778 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：56520
总ram位数：1869824
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：1074778
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL060TS-FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(3) "977" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(19) "M2GL060-1FGG484I-ND" ["zzsbh"]=> string(16) "M2GL060-1FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(5) "56520" ["ljyj_dys"]=> string(7) "1869824" ["zram_ws"]=> string(3) "267" ["io_num"]=> string(3) "267" ["sjs"]=> string(0) "" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL060-1FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 977 ) LIMIT 1
系列：IGLOO2
lab/clb数：56520
逻辑元件/单元数：1869824
总ram位数：267
i/o 数：267
栅极数：
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：1074977
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL060-1FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(3) "979" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(18) "M2GL060-FGG484I-ND" ["zzsbh"]=> string(15) "M2GL060-FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(5) "56520" ["ljyj_dys"]=> string(7) "1869824" ["zram_ws"]=> string(3) "267" ["io_num"]=> string(3) "267" ["sjs"]=> string(0) "" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL060-FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 979 ) LIMIT 1
系列：IGLOO2
lab/clb数：56520
逻辑元件/单元数：1869824
总ram位数：267
i/o 数：267
栅极数：
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：1074979
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL060-FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(4) "2063" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(19) "M2GL060T-1FGG484-ND" ["zzsbh"]=> string(16) "M2GL060T-1FGG484" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "56520" ["zram_ws"]=> string(7) "1869824" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL060T-1FGG484复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 2063 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：56520
总ram位数：1869824
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：10742063
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL060T-1FGG484' ) LIMIT 1
array(69) { ["id"]=> string(4) "2065" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(18) "M2GL060T-FGG484-ND" ["zzsbh"]=> string(15) "M2GL060T-FGG484" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 267 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "56520" ["zram_ws"]=> string(7) "1869824" ["io_num"]=> string(3) "267" ["sjs"]=> string(3) "267" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL060T-FGG484复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 267 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 2065 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：56520
总ram位数：1869824
i/o 数：267
栅极数：267
电压-电源(v)：1.14V ~ 2.625V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：10742065
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL060T-FGG484' ) LIMIT 1
array(69) { ["id"]=> string(4) "2104" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(89) "//media.digikey.com/Renders/Microsemi%20Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images"]=> string(109) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/1100;-FGG484-2.44-23x23;-FG,-FGG;-484.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(18) "M2GL005-FGG484I-ND" ["zzsbh"]=> string(15) "M2GL005-FGG484I" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 209 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(4) "6060" ["zram_ws"]=> string(6) "719872" ["io_num"]=> string(3) "209" ["sjs"]=> string(3) "209" ["dydy"]=> string(14) "1.14V ~ 2.625V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL005-FGG484I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 209 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 2104 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：6060
总ram位数：719872
i/o 数：209
栅极数：209
电压-电源(v)：1.14V ~ 2.625V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：10742104
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL005-FGG484I' ) LIMIT 1
array(69) { ["id"]=> string(4) "2117" ["pdf_add"]=> string(101) "http://www.microsemi.com/document-portal/doc_download/132042-ds0128-igloo2-and-smartfusion2-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(0) "" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(18) "M2GL005S-FGG484-ND" ["zzsbh"]=> string(15) "M2GL005S-FGG484" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 209 I/O 484FBGA" ["xl"]=> string(6) "IGLOO2" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(4) "6060" ["zram_ws"]=> string(6) "719872" ["io_num"]=> string(3) "209" ["sjs"]=> string(1) "-" ["dydy"]=> string(16) "1.14 v ~ 2.625 v" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(20) "0°c ~ 85°c（tj）" ["fz_wk"]=> string(7) "484-BGA" ["gysqjfz"]=> string(19) "484-FBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "484" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M2GL005S-FGG484复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：484-FBGA（23X23）
外壳：484-BGA
描述： IC FPGA 209 I/O 484FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 2117 ) LIMIT 1
系列：IGLOO2
lab/clb数：-
逻辑元件/单元数：6060
总ram位数：719872
i/o 数：209
栅极数：-
电压-电源(v)：1.14 v ~ 2.625 v
工作温度：0°c ~ 85°c（tj）
丝印：(请登录)
料号：10742117
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M2GL005S-FGG484' ) LIMIT 1

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