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array(68) { ["id"]=> string(3) "621" ["pdf_add"]=> string(71) "http://media.digikey.com/pdf/Data%20Sheets/Microsemi%20PDFs/ZL30301.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(13) "ZL30301GAG-ND" ["zzsbh"]=> string(10) "ZL30301GAG" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(27) "IC TELECOM INTERFACE 324BGA" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(12) "电信电路" ["jk"]=> string(1) "-" ["dls"]=> string(1) "1" ["dydy"]=> string(9) "3V ~ 3.6V" ["dldy"]=> string(5) "950mA" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： ZL30301GAG复制
状态： 停产 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-BGA
描述： IC TELECOM INTERFACE 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 621 ) LIMIT 1
系列：
功能：电信电路
接口：-
电路数：1
电压-电源输入(v)：3V ~ 3.6V
电流-电源输出(a)：950mA
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：1086621
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'ZL30301GAG' ) LIMIT 1
array(68) { ["id"]=> string(3) "622" ["pdf_add"]=> string(71) "http://media.digikey.com/pdf/Data%20Sheets/Microsemi%20PDFs/ZL30302.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(13) "ZL30302GAG-ND" ["zzsbh"]=> string(10) "ZL30302GAG" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(27) "IC TELECOM INTERFACE 324BGA" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(12) "电信电路" ["jk"]=> string(1) "-" ["dls"]=> string(1) "1" ["dydy"]=> string(9) "3V ~ 3.6V" ["dldy"]=> string(5) "950mA" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： ZL30302GAG复制
状态： 停产 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-BGA
描述： IC TELECOM INTERFACE 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 622 ) LIMIT 1
系列：
功能：电信电路
接口：-
电路数：1
电压-电源输入(v)：3V ~ 3.6V
电流-电源输出(a)：950mA
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：1086622
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'ZL30302GAG' ) LIMIT 1
array(68) { ["id"]=> string(4) "1894" ["pdf_add"]=> string(71) "http://media.digikey.com/pdf/Data%20Sheets/Microsemi%20PDFs/ZL30302.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(14) "ZL30302GAG2-ND" ["zzsbh"]=> string(11) "ZL30302GAG2" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(27) "IC TELECOM INTERFACE 324BGA" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(12) "电信电路" ["jk"]=> string(1) "-" ["dls"]=> string(1) "1" ["dydy"]=> string(9) "3V ~ 3.6V" ["dldy"]=> string(5) "950mA" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： ZL30302GAG2复制
状态： 停产 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-BGA
描述： IC TELECOM INTERFACE 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 1894 ) LIMIT 1
系列：
功能：电信电路
接口：-
电路数：1
电压-电源输入(v)：3V ~ 3.6V
电流-电源输出(a)：950mA
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10861894
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'ZL30302GAG2' ) LIMIT 1
array(68) { ["id"]=> string(4) "2480" ["pdf_add"]=> string(88) "http://www.microsemi.com/document-portal/doc_download/127191-zl50115-120-datasheet-oct09" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(47) "https://www.makuwang.com/Public/Mark/img/mk.png" ["images"]=> string(54) "https://www.chenkeiot.com/Public/Mark/img/red_logo.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(11) "ZL50115GAG2" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC CESOP PROCESSOR 32CH 324BGA" ["xl"]=> string(1) "-" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(21) "Microsemi Corporation" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(12) "电信电路" ["jk"]=> string(3) "TDM" ["dls"]=> string(1) "1" ["dydy"]=> string(15) "1.65 V ~ 1.95 V" ["dldy"]=> string(5) "950mA" ["gl"]=> string(0) "" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(12) "表面贴装" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-PBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(1) "-" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999533" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： ZL50115GAG2复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23X23）
外壳：324-BGA
描述： IC CESOP PROCESSOR 32CH 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2480 ) LIMIT 1
系列：-
功能：电信电路
接口：TDM
电路数：1
电压-电源输入(v)：1.65 V ~ 1.95 V
电流-电源输出(a)：950mA
功率(w)：
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862480
量大可议价
起订量:5 修改
包装量: 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'ZL50115GAG2' ) LIMIT 1
array(68) { ["id"]=> string(4) "2494" ["pdf_add"]=> string(88) "http://www.microsemi.com/document-portal/doc_download/127191-zl50115-120-datasheet-oct09" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(11) "ZL50118GAG2" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(27) "IC TELECOM INTERFACE 324BGA" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(12) "电信电路" ["jk"]=> string(3) "TDM" ["dls"]=> string(1) "1" ["dydy"]=> string(13) "1.65V ~ 1.95V" ["dldy"]=> string(5) "950mA" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999538" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： ZL50118GAG2复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-BGA
描述： IC TELECOM INTERFACE 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2494 ) LIMIT 1
系列：
功能：电信电路
接口：TDM
电路数：1
电压-电源输入(v)：1.65V ~ 1.95V
电流-电源输出(a)：950mA
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862494
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'ZL50118GAG2' ) LIMIT 1
array(68) { ["id"]=> string(4) "2496" ["pdf_add"]=> string(88) "http://www.microsemi.com/document-portal/doc_download/127191-zl50115-120-datasheet-oct09" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(11) "ZL50116GAG2" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(27) "IC TELECOM INTERFACE 324BGA" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(12) "电信电路" ["jk"]=> string(3) "TDM" ["dls"]=> string(1) "1" ["dydy"]=> string(13) "1.65V ~ 1.95V" ["dldy"]=> string(5) "950mA" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999538" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： ZL50116GAG2复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-BGA
描述： IC TELECOM INTERFACE 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2496 ) LIMIT 1
系列：
功能：电信电路
接口：TDM
电路数：1
电压-电源输入(v)：1.65V ~ 1.95V
电流-电源输出(a)：950mA
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862496
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'ZL50116GAG2' ) LIMIT 1
array(68) { ["id"]=> string(4) "2504" ["pdf_add"]=> string(88) "http://www.microsemi.com/document-portal/doc_download/127191-zl50115-120-datasheet-oct09" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(47) "https://www.makuwang.com/Public/Mark/img/mk.png" ["images"]=> string(54) "https://www.chenkeiot.com/Public/Mark/img/red_logo.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(11) "ZL50119GAG2" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC CESOP PROCESSOR 64CH 324BGA" ["xl"]=> string(1) "-" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(21) "Microsemi Corporation" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(12) "电信电路" ["jk"]=> string(3) "TDM" ["dls"]=> string(1) "1" ["dydy"]=> string(15) "1.65 V ~ 1.95 V" ["dldy"]=> string(5) "950mA" ["gl"]=> string(0) "" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(12) "表面贴装" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-PBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(1) "-" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999544" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： ZL50119GAG2复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23X23）
外壳：324-BGA
描述： IC CESOP PROCESSOR 64CH 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2504 ) LIMIT 1
系列：-
功能：电信电路
接口：TDM
电路数：1
电压-电源输入(v)：1.65 V ~ 1.95 V
电流-电源输出(a)：950mA
功率(w)：
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862504
量大可议价
起订量:5 修改
包装量: 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'ZL50119GAG2' ) LIMIT 1
array(68) { ["id"]=> string(4) "2505" ["pdf_add"]=> string(87) "http://esc.microsemi.com/cgi-bin/download_p.pl?res_id=11613&filename=2051525_011613.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(10) "PM8312-PGI" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(28) "IC TELECOM INTERFACE 32 CHAN" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(9) "成帧器" ["jk"]=> string(12) "E1，J1，T1" ["dls"]=> string(2) "32" ["dydy"]=> string(11) "1.8V，3.3V" ["dldy"]=> string(1) "-" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(8) "324-FBGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999545" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： PM8312-PGI复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-FBGA
描述： IC TELECOM INTERFACE 32 CHAN
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2505 ) LIMIT 1
系列：
功能：成帧器
接口：E1，J1，T1
电路数：32
电压-电源输入(v)：1.8V，3.3V
电流-电源输出(a)：-
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862505
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'PM8312-PGI' ) LIMIT 1
array(68) { ["id"]=> string(4) "2506" ["pdf_add"]=> string(88) "http://www.microsemi.com/document-portal/doc_download/127191-zl50115-120-datasheet-oct09" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(11) "ZL50117GAG2" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(27) "IC TELECOM INTERFACE 324BGA" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(12) "电信电路" ["jk"]=> string(3) "TDM" ["dls"]=> string(1) "1" ["dydy"]=> string(13) "1.65V ~ 1.95V" ["dldy"]=> string(5) "950mA" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999545" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： ZL50117GAG2复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-BGA
描述： IC TELECOM INTERFACE 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2506 ) LIMIT 1
系列：
功能：电信电路
接口：TDM
电路数：1
电压-电源输入(v)：1.65V ~ 1.95V
电流-电源输出(a)：950mA
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862506
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'ZL50117GAG2' ) LIMIT 1
array(68) { ["id"]=> string(4) "2513" ["pdf_add"]=> string(88) "http://www.microsemi.com/document-portal/doc_download/127191-zl50115-120-datasheet-oct09" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(47) "https://www.makuwang.com/Public/Mark/img/mk.png" ["images"]=> string(54) "https://www.chenkeiot.com/Public/Mark/img/red_logo.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(11) "ZL50120GAG2" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(31) "IC CESOP PROCESSOR 128CH 324BGA" ["xl"]=> string(1) "-" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(21) "Microsemi Corporation" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(12) "电信电路" ["jk"]=> string(3) "TDM" ["dls"]=> string(1) "1" ["dydy"]=> string(15) "1.65 V ~ 1.95 V" ["dldy"]=> string(5) "950mA" ["gl"]=> string(0) "" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(12) "表面贴装" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-PBGA（23X23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(1) "-" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999545" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： ZL50120GAG2复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23X23）
外壳：324-BGA
描述： IC CESOP PROCESSOR 128CH 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2513 ) LIMIT 1
系列：-
功能：电信电路
接口：TDM
电路数：1
电压-电源输入(v)：1.65 V ~ 1.95 V
电流-电源输出(a)：950mA
功率(w)：
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862513
量大可议价
起订量:5 修改
包装量: 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'ZL50120GAG2' ) LIMIT 1
array(68) { ["id"]=> string(4) "2514" ["pdf_add"]=> string(87) "http://esc.microsemi.com/cgi-bin/download_p.pl?res_id=11613&filename=2051525_011613.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(9) "PM8312-PI" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(28) "IC TELECOM INTERFACE 32 CHAN" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(9) "成帧器" ["jk"]=> string(12) "E1，J1，T1" ["dls"]=> string(2) "32" ["dydy"]=> string(11) "1.8V，3.3V" ["dldy"]=> string(1) "-" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(8) "324-FBGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999545" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： PM8312-PI复制
状态： 停产 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-FBGA
描述： IC TELECOM INTERFACE 32 CHAN
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2514 ) LIMIT 1
系列：
功能：成帧器
接口：E1，J1，T1
电路数：32
电压-电源输入(v)：1.8V，3.3V
电流-电源输出(a)：-
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862514
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'PM8312-PI' ) LIMIT 1
array(68) { ["id"]=> string(4) "2541" ["pdf_add"]=> string(79) "http://esc.microsemi.com/cgi-bin/download_p.pl?res_id=1576&filename=2001514.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(10) "PM8316-PGI" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(31) "IC TELECOM INTERFACE 84/63 CHAN" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(39) "调帧器，线路接口单元（LIU）" ["jk"]=> string(3) "SPI" ["dls"]=> string(2) "84" ["dydy"]=> string(1) "-" ["dldy"]=> string(1) "-" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(8) "324-FBGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999556" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： PM8316-PGI复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-FBGA
描述： IC TELECOM INTERFACE 84/63 CHAN
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2541 ) LIMIT 1
系列：
功能：调帧器，线路接口单元（LIU）
接口：SPI
电路数：84
电压-电源输入(v)：-
电流-电源输出(a)：-
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862541
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'PM8316-PGI' ) LIMIT 1
array(68) { ["id"]=> string(4) "2542" ["pdf_add"]=> string(86) "http://esc.microsemi.com/cgi-bin/download_p.pl?res_id=7927&filename=2021488_005062.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(10) "PM8320-PGI" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(27) "IC TELECOM INTERFACE 324BGA" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(9) "成帧器" ["jk"]=> string(12) "E1，J1，T1" ["dls"]=> string(1) "-" ["dydy"]=> string(11) "1.8V，3.3V" ["dldy"]=> string(1) "-" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(8) "324-FBGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999556" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： PM8320-PGI复制
状态： 停产 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-FBGA
描述： IC TELECOM INTERFACE 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2542 ) LIMIT 1
系列：
功能：成帧器
接口：E1，J1，T1
电路数：-
电压-电源输入(v)：1.8V，3.3V
电流-电源输出(a)：-
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862542
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'PM8320-PGI' ) LIMIT 1
array(68) { ["id"]=> string(4) "2544" ["pdf_add"]=> string(79) "http://esc.microsemi.com/cgi-bin/download_p.pl?res_id=1576&filename=2001514.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(9) "PM8316-PI" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(31) "IC TELECOM INTERFACE 84/63 CHAN" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(9) "成帧器" ["jk"]=> string(12) "E1，J1，T1" ["dls"]=> string(2) "84" ["dydy"]=> string(11) "1.8V，3.3V" ["dldy"]=> string(1) "-" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(8) "324-FBGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999556" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： PM8316-PI复制
状态： 停产 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-FBGA
描述： IC TELECOM INTERFACE 84/63 CHAN
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2544 ) LIMIT 1
系列：
功能：成帧器
接口：E1，J1，T1
电路数：84
电压-电源输入(v)：1.8V，3.3V
电流-电源输出(a)：-
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862544
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'PM8316-PI' ) LIMIT 1
array(68) { ["id"]=> string(4) "2545" ["pdf_add"]=> string(86) "http://esc.microsemi.com/cgi-bin/download_p.pl?res_id=7927&filename=2021488_005062.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(9) "PM8320-PI" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(27) "IC TELECOM INTERFACE 324BGA" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(9) "成帧器" ["jk"]=> string(12) "E1，J1，T1" ["dls"]=> string(1) "-" ["dydy"]=> string(11) "1.8V，3.3V" ["dldy"]=> string(1) "-" ["gl"]=> string(1) "-" ["gzwd"]=> string(14) "-40°C ~ 85°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(8) "324-FBGA" ["gysqjfz"]=> string(19) "324-PBGA（23x23）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "60" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "30" ["wl_num"]=> string(4) "1086" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_dx" ["ch_bm"]=> string(18) "电信接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1517999556" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_dx' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1086" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 电信接口芯片" ["action_name"]=> string(3) "j11" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： PM8320-PI复制
状态： 停产 修改
品牌： Microchip/微芯复制
封装：324-PBGA（23x23）
外壳：324-FBGA
描述： IC TELECOM INTERFACE 324BGA
SELECT * FROM `golon_jk_dx` WHERE ( `id` = 2545 ) LIMIT 1
系列：
功能：成帧器
接口：E1，J1，T1
电路数：-
电压-电源输入(v)：1.8V，3.3V
电流-电源输出(a)：-
功率(w)：-
工作温度(°C)：-40°C ~ 85°C
丝印：(请登录)
料号：10862545
量大可议价
起订量:5 修改
包装量: 60个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'PM8320-PI' ) LIMIT 1

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