首页 >> 所有制造商 >> Microchip/微芯

类目:
更多
封装:
清除条件
封装图 商品描述 综合参数 封装规格/资料 价格(含税) 数量 操作
array(72) { ["id"]=> string(4) "3666" ["pdf_add"]=> string(68) "http://media.digikey.com/pdf/Data%20Sheets/Atmel%20PDFs/TSPC603R.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["ljbh"]=> string(18) "TSPC603RVGH10LC-ND" ["zzsbh"]=> string(15) "TSPC603RVGH10LC" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(26) "IC MPU 603E 233MHZ 255CBGA" ["xl"]=> string(1) "-" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(5) "Atmel" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["hxclq"]=> string(12) "PowerPC 603e" ["hs_zxkd"]=> string(17) "1 코어，32 位" ["ram_kzq"]=> string(1) "-" ["sd"]=> string(6) "233MHz" ["xclq_dsp"]=> string(1) "-" ["txjs"]=> string(4) "txjs" ["xs_jk_kzq"]=> string(3) "无" ["ytw"]=> string(1) "-" ["sata"]=> string(1) "-" ["usb"]=> string(1) "-" ["dy_io"]=> string(1) "-" ["gzwd"]=> string(23) "-40°C ~ 110°C（TC）" ["aqtx"]=> string(1) "-" ["fz_wk"]=> string(22) "255-CBBGA 裸露焊盘" ["gysqjfz"]=> string(25) "255-HITCE-CBGA（21X21）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(0) "" ["spq"]=> string(1) "-" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "255" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "12" ["wl_num"]=> string(4) "1069" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_wclq" ["ch_bm"]=> string(27) "嵌入式处理器(CPU/MPU)" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_wclq' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1069" ["parent_id"]=> string(1) "8" ["lb"]=> string(38) "嵌入式 嵌入式处理器(CPU/MPU)" ["action_name"]=> string(2) "q3" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4150" } }
型号： TSPC603RVGH10LC复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：255-HITCE-CBGA（21X21）
外壳：255-CBBGA 裸露焊盘
描述： IC MPU 603E 233MHZ 255CBGA
SELECT * FROM `golon_qrs_wclq` WHERE ( `id` = 3666 ) LIMIT 1
系列：-
核心处理器：PowerPC 603e
核数/总线宽度：1 코어，32 位
ram 控制器：-
速度：233MHz
电压 - i/o：-
工作温度：-40°C ~ 110°C（TC）
丝印：(请登录)
料号：10693666
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'TSPC603RVGH10LC' ) LIMIT 1
array(72) { ["id"]=> string(4) "3667" ["pdf_add"]=> string(68) "http://media.digikey.com/pdf/Data%20Sheets/Atmel%20PDFs/TSPC603R.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["ljbh"]=> string(18) "TSPC603RVGH12LC-ND" ["zzsbh"]=> string(15) "TSPC603RVGH12LC" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(26) "IC MPU 603E 266MHZ 255CBGA" ["xl"]=> string(1) "-" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(5) "Atmel" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["hxclq"]=> string(12) "PowerPC 603e" ["hs_zxkd"]=> string(17) "1 코어，32 位" ["ram_kzq"]=> string(1) "-" ["sd"]=> string(6) "266MHz" ["xclq_dsp"]=> string(1) "-" ["txjs"]=> string(4) "txjs" ["xs_jk_kzq"]=> string(3) "无" ["ytw"]=> string(1) "-" ["sata"]=> string(1) "-" ["usb"]=> string(1) "-" ["dy_io"]=> string(1) "-" ["gzwd"]=> string(23) "-40°C ~ 110°C（TC）" ["aqtx"]=> string(1) "-" ["fz_wk"]=> string(22) "255-CBBGA 裸露焊盘" ["gysqjfz"]=> string(25) "255-HITCE-CBGA（21X21）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(0) "" ["spq"]=> string(1) "-" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "255" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "12" ["wl_num"]=> string(4) "1069" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_wclq" ["ch_bm"]=> string(27) "嵌入式处理器(CPU/MPU)" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_wclq' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1069" ["parent_id"]=> string(1) "8" ["lb"]=> string(38) "嵌入式 嵌入式处理器(CPU/MPU)" ["action_name"]=> string(2) "q3" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4150" } }
型号： TSPC603RVGH12LC复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：255-HITCE-CBGA（21X21）
外壳：255-CBBGA 裸露焊盘
描述： IC MPU 603E 266MHZ 255CBGA
SELECT * FROM `golon_qrs_wclq` WHERE ( `id` = 3667 ) LIMIT 1
系列：-
核心处理器：PowerPC 603e
核数/总线宽度：1 코어，32 位
ram 控制器：-
速度：266MHz
电压 - i/o：-
工作温度：-40°C ~ 110°C（TC）
丝印：(请登录)
料号：10693667
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'TSPC603RVGH12LC' ) LIMIT 1
array(72) { ["id"]=> string(4) "3768" ["pdf_add"]=> string(68) "http://media.digikey.com/pdf/Data%20Sheets/Atmel%20PDFs/TSPC603R.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["ljbh"]=> string(17) "TSPC603RVGH8LC-ND" ["zzsbh"]=> string(14) "TSPC603RVGH8LC" ["zddgs"]=> string(2) "60" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(26) "IC MPU 603E 200MHZ 255CBGA" ["xl"]=> string(1) "-" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(5) "Atmel" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["hxclq"]=> string(12) "PowerPC 603e" ["hs_zxkd"]=> string(17) "1 코어，32 位" ["ram_kzq"]=> string(1) "-" ["sd"]=> string(6) "200MHz" ["xclq_dsp"]=> string(1) "-" ["txjs"]=> string(4) "txjs" ["xs_jk_kzq"]=> string(3) "无" ["ytw"]=> string(1) "-" ["sata"]=> string(1) "-" ["usb"]=> string(1) "-" ["dy_io"]=> string(1) "-" ["gzwd"]=> string(23) "-40°C ~ 110°C（TC）" ["aqtx"]=> string(1) "-" ["fz_wk"]=> string(22) "255-CBBGA 裸露焊盘" ["gysqjfz"]=> string(25) "255-HITCE-CBGA（21X21）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(0) "" ["spq"]=> string(1) "-" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "255" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "12" ["wl_num"]=> string(4) "1069" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_wclq" ["ch_bm"]=> string(27) "嵌入式处理器(CPU/MPU)" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_wclq' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1069" ["parent_id"]=> string(1) "8" ["lb"]=> string(38) "嵌入式 嵌入式处理器(CPU/MPU)" ["action_name"]=> string(2) "q3" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4150" } }
型号： TSPC603RVGH8LC复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：255-HITCE-CBGA（21X21）
外壳：255-CBBGA 裸露焊盘
描述： IC MPU 603E 200MHZ 255CBGA
SELECT * FROM `golon_qrs_wclq` WHERE ( `id` = 3768 ) LIMIT 1
系列：-
核心处理器：PowerPC 603e
核数/总线宽度：1 코어，32 位
ram 控制器：-
速度：200MHz
电压 - i/o：-
工作温度：-40°C ~ 110°C（TC）
丝印：(请登录)
料号：10693768
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'TSPC603RVGH8LC' ) LIMIT 1
array(72) { ["id"]=> string(4) "6593" ["pdf_add"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(49) "//media.digikey.com/Photos/NoPhoto/pna_zh_tmb.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(22) "WED3C7410E16MC-400BH9I" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(32) "RISC MICROPROCESSOR, 400MHZ, CMO" ["xl"]=> string(1) "-" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(21) "Microsemi Corporation" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["hxclq"]=> string(1) "-" ["hs_zxkd"]=> string(1) "-" ["ram_kzq"]=> string(1) "-" ["sd"]=> string(6) "400MHz" ["xclq_dsp"]=> string(1) "-" ["txjs"]=> string(1) "-" ["xs_jk_kzq"]=> string(1) "-" ["ytw"]=> string(1) "-" ["sata"]=> string(1) "-" ["usb"]=> string(1) "-" ["dy_io"]=> string(1) "-" ["gzwd"]=> string(1) "-" ["aqtx"]=> string(1) "-" ["fz_wk"]=> string(22) "255-BCBGA 裸露焊盘" ["gysqjfz"]=> string(25) "255-HiTCE-CBGA（21x21）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> NULL ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "255" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(21) "不适用于新设计" ["jyid"]=> NULL ["cat_id"]=> string(2) "12" ["wl_num"]=> string(4) "1069" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_wclq" ["ch_bm"]=> string(27) "嵌入式处理器(CPU/MPU)" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1627365855" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_wclq' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1069" ["parent_id"]=> string(1) "8" ["lb"]=> string(38) "嵌入式 嵌入式处理器(CPU/MPU)" ["action_name"]=> string(2) "q3" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4150" } }
型号： WED3C7410E16MC-400BH9I复制
状态： 不适用于新设计 修改
品牌： Microchip/微芯复制
封装：255-HiTCE-CBGA（21x21）
外壳：255-BCBGA 裸露焊盘
描述： RISC MICROPROCESSOR, 400MHZ, CMO
SELECT * FROM `golon_qrs_wclq` WHERE ( `id` = 6593 ) LIMIT 1
系列：-
核心处理器：-
核数/总线宽度：-
ram 控制器：-
速度：400MHz
电压 - i/o：-
工作温度：-
丝印：(请登录)
料号：10696593
量大可议价
起订量:5 修改
包装量: 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'WED3C7410E16MC-400BH9I' ) LIMIT 1

辰科物联

https://www.chenkeiot.com/

已成功加入购物车！
去购物车结算 继续采购
复制成功

业务介绍

芯片采购
芯片丝印
商品选型
芯片烧录
开发工具
Bom采购
SMT贴片

购物指南

注册登录
找回密码
购物流程
常见问题
支付方式
配送方式

联系我们

直线：0755-28435922
总部地址：广东省深圳市龙岗区坂田上雪村金鹏工业区新一栋5楼
联系我们
公司简介

关注我们

微信扫码
辰科物联介绍

粤公网安备 号

粤ICP备2023141824号-1

Copyright © 2002-2025 深圳市辰科物联有限公司 版权所有

销售在线 销售在线 工程师在线 工程师在线 电话咨询

销售在线

刘s:2355289363

手机: 15074164838

销售在线

陈s:2355289368

手机: 13510573285

工程师在线

吴工:2355289360

手机: 13824329149

工程师在线

陈工:2355289365

手机: 15818753382

电话咨询

0755-28435922