select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }

封装：20-WLCSP（2.1x1.7）

外壳：20-UFBGA，WLCSP

描述： IC INTFACE SPECIALIZED 20WLCSP