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array(65) { ["id"]=> string(4) "3922" ["pdf_add"]=> string(53) "http://cache.nxp.com/documents/data_sheet/UJA1169.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(10) "UJA1169TKZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC INTFACE SPECIALIZED 20HVSON" ["xl"]=> string(20) "Automotive, AEC-Q100" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(20) "车规级/Automotive" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1519540378" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169TKZ复制
状态： 停产 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC INTFACE SPECIALIZED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 3922 ) LIMIT 1
系列：Automotive, AEC-Q100
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10763922
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带（TR） 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169TKZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "3923" ["pdf_add"]=> string(49) "http://www.nxp.com/docs/en/data-sheet/UJA1169.pdf" ["pdf_dir"]=> string(28) "./datasheet/1076/UJA1169.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(12) "UJA1169TK/3Z" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC INTFACE SPECIALIZED 20HVSON" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1519540378" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169TK/3Z复制
状态： 停产 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC INTFACE SPECIALIZED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 3923 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10763923
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带（TR） 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169TK/3Z' ) LIMIT 1
array(65) { ["id"]=> string(4) "3924" ["pdf_add"]=> string(50) "http://www.nxp.com/docs/en/data-sheet/UJA1169L.pdf" ["pdf_dir"]=> string(29) "./datasheet/1076/UJA1169L.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(11) "UJA1169LTKZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC INTFACE SPECIALIZED 20HVSON" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1519540378" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169LTKZ复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC INTFACE SPECIALIZED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 3924 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10763924
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带（TR） 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169LTKZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "3925" ["pdf_add"]=> string(53) "http://cache.nxp.com/documents/data_sheet/UJA1169.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(12) "UJA1169TK/XZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC INTFACE SPECIALIZED 20HVSON" ["xl"]=> string(20) "Automotive, AEC-Q100" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(20) "车规级/Automotive" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1519540378" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169TK/XZ复制
状态： 停产 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC INTFACE SPECIALIZED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 3925 ) LIMIT 1
系列：Automotive, AEC-Q100
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10763925
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带（TR） 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169TK/XZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "3926" ["pdf_add"]=> string(50) "http://www.nxp.com/docs/en/data-sheet/UJA1169L.pdf" ["pdf_dir"]=> string(29) "./datasheet/1076/UJA1169L.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(13) "UJA1169LTK/XZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC INTFACE SPECIALIZED 20HVSON" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1519540378" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169LTK/XZ复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC INTFACE SPECIALIZED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 3926 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10763926
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带（TR） 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169LTK/XZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "3929" ["pdf_add"]=> string(53) "http://cache.nxp.com/documents/data_sheet/UJA1169.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(12) "UJA1169TK/FZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC INTFACE SPECIALIZED 20HVSON" ["xl"]=> string(20) "Automotive, AEC-Q100" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(20) "车规级/Automotive" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(4) "1500" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1519540378" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169TK/FZ复制
状态： 停产 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC INTFACE SPECIALIZED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 3929 ) LIMIT 1
系列：Automotive, AEC-Q100
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10763929
量大可议价
起订量:5 修改
包装量: 1500个/ 卷带（TR） 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169TK/FZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "3930" ["pdf_add"]=> string(49) "http://www.nxp.com/docs/en/data-sheet/UJA1169.pdf" ["pdf_dir"]=> string(28) "./datasheet/1076/UJA1169.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(14) "UJA1169TK/F/3Z" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC INTFACE SPECIALIZED 20HVSON" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1519540383" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169TK/F/3Z复制
状态： 停产 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC INTFACE SPECIALIZED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 3930 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10763930
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带（TR） 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169TK/F/3Z' ) LIMIT 1
array(65) { ["id"]=> string(4) "3931" ["pdf_add"]=> string(50) "http://www.nxp.com/docs/en/data-sheet/UJA1169L.pdf" ["pdf_dir"]=> string(29) "./datasheet/1076/UJA1169L.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(13) "UJA1169LTK/FZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC INTFACE SPECIALIZED 20HVSON" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1519540383" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169LTK/FZ复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC INTFACE SPECIALIZED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 3931 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10763931
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带（TR） 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169LTK/FZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "3934" ["pdf_add"]=> string(53) "http://cache.nxp.com/documents/data_sheet/UJA1169.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(14) "UJA1169TK/X/FZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC INTFACE SPECIALIZED 20HVSON" ["xl"]=> string(20) "Automotive, AEC-Q100" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(20) "车规级/Automotive" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1519540384" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169TK/X/FZ复制
状态： 停产 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC INTFACE SPECIALIZED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 3934 ) LIMIT 1
系列：Automotive, AEC-Q100
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10763934
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带（TR） 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169TK/X/FZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "3935" ["pdf_add"]=> string(50) "http://www.nxp.com/docs/en/data-sheet/UJA1169L.pdf" ["pdf_dir"]=> string(29) "./datasheet/1076/UJA1169L.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(15) "UJA1169LTK/X/FZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC INTFACE SPECIALIZED 20HVSON" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1519540384" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169LTK/X/FZ复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC INTFACE SPECIALIZED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 3935 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10763935
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带（TR） 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169LTK/X/FZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "4312" ["pdf_add"]=> string(70) "//mm.digikey.com/Volume0/opasdata/d220001/medias/docus/491/UJA1169.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/461/568%7ESOT1360-1%7E%7E20.jpg" ["images_dir"]=> string(32) "./images/1076/UJA1169ATK_F_3.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(14) "UJA1169ATK/F/3" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(29) "IC SBC CAN HIGH SPEED 20HVSON" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(3) "CAN" ["dydy"]=> string(2) "5V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "散装" ["spq"]=> string(0) "" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1598843688" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169ATK/F/3复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC SBC CAN HIGH SPEED 20HVSON
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 4312 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5V
工作温度：-
丝印：(请登录)
料号：10764312
量大可议价
起订量:5 修改
包装量: 散装 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169ATK/F/3' ) LIMIT 1
array(65) { ["id"]=> string(4) "4514" ["pdf_add"]=> string(51) "https://www.nxp.com/docs/en/data-sheet/UJA1169A.pdf" ["pdf_dir"]=> string(29) "./datasheet/1076/UJA1169A.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/461/568%7ESOT1360-1%7E%7E20.jpg" ["images_dir"]=> string(32) "./images/1076/UJA1169ATK_F_3.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(13) "UJA1169ATK/3Z" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "13.942300" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(29) "IC MINI-CAN SYSTEM BASIS CHIP" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(9) "CAN，SPI" ["dydy"]=> string(8) "3V ~ 28V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> NULL ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1630391771" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169ATK/3Z复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC MINI-CAN SYSTEM BASIS CHIP
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 4514 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，SPI
电压-电源输入(V)：3V ~ 28V
工作温度：-
丝印：(请登录)
料号：10764514
5+: ￥19.59
3000+: ￥14.71
起订量:5 修改
包装量: 3000个/ 卷带 修改
个
总额：
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169ATK/3Z' ) LIMIT 1
array(65) { ["id"]=> string(4) "4515" ["pdf_add"]=> string(0) "" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(74) "//media.digikey.com/Renders/NXP%20Semi%20Renders/568~SOT1360-1~~20_tmb.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(11) "UJA1169ATKZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(29) "IC MINI-CAN SYSTEM BASIS CHIP" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(9) "CAN，SPI" ["dydy"]=> string(8) "3V ~ 28V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> NULL ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1630391771" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169ATKZ复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC MINI-CAN SYSTEM BASIS CHIP
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 4515 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，SPI
电压-电源输入(V)：3V ~ 28V
工作温度：-
丝印：(请登录)
料号：10764515
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带 修改
个
总额：
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169ATKZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "4516" ["pdf_add"]=> string(0) "" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(74) "//media.digikey.com/Renders/NXP%20Semi%20Renders/568~SOT1360-1~~20_tmb.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(13) "UJA1169ATK/XZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(29) "IC MINI-CAN SYSTEM BASIS CHIP" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(9) "CAN，SPI" ["dydy"]=> string(8) "3V ~ 28V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> NULL ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1630391771" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169ATK/XZ复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC MINI-CAN SYSTEM BASIS CHIP
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 4516 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，SPI
电压-电源输入(V)：3V ~ 28V
工作温度：-
丝印：(请登录)
料号：10764516
量大可议价
起订量:5 修改
包装量: 3000个/ 卷带 修改
个
总额：
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169ATK/XZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "4518" ["pdf_add"]=> string(51) "https://www.nxp.com/docs/en/data-sheet/UJA1169A.pdf" ["pdf_dir"]=> string(29) "./datasheet/1076/UJA1169A.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/461/568%7ESOT1360-1%7E%7E20.jpg" ["images_dir"]=> string(32) "./images/1076/UJA1169ATK_F_3.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(13) "UJA1169ATK/FZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "18.139790" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(29) "IC MINI-CAN SYSTEM BASIS CHIP" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(9) "CAN，SPI" ["dydy"]=> string(8) "3V ~ 28V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> NULL ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1630395667" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169ATK/FZ复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC MINI-CAN SYSTEM BASIS CHIP
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 4518 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，SPI
电压-电源输入(V)：3V ~ 28V
工作温度：-
丝印：(请登录)
料号：10764518
5+: ￥25.49
3000+: ￥19.14
起订量:5 修改
包装量: 3000个/ 卷带 修改
个
总额：
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169ATK/FZ' ) LIMIT 1
array(65) { ["id"]=> string(4) "4519" ["pdf_add"]=> string(51) "https://www.nxp.com/docs/en/data-sheet/UJA1169A.pdf" ["pdf_dir"]=> string(29) "./datasheet/1076/UJA1169A.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/461/568%7ESOT1360-1%7E%7E20.jpg" ["images_dir"]=> string(32) "./images/1076/UJA1169ATK_F_3.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(15) "UJA1169ATK/F/3Z" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "16.731170" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(29) "IC MINI-CAN SYSTEM BASIS CHIP" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(9) "CAN，SPI" ["dydy"]=> string(8) "3V ~ 28V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> NULL ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1630395667" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169ATK/F/3Z复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC MINI-CAN SYSTEM BASIS CHIP
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 4519 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，SPI
电压-电源输入(V)：3V ~ 28V
工作温度：-
丝印：(请登录)
料号：10764519
5+: ￥23.51
3000+: ￥17.65
起订量:5 修改
包装量: 3000个/ 卷带 修改
个
总额：
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169ATK/F/3Z' ) LIMIT 1
array(65) { ["id"]=> string(4) "4520" ["pdf_add"]=> string(51) "https://www.nxp.com/docs/en/data-sheet/UJA1169A.pdf" ["pdf_dir"]=> string(29) "./datasheet/1076/UJA1169A.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/461/568%7ESOT1360-1%7E%7E20.jpg" ["images_dir"]=> string(32) "./images/1076/UJA1169ATK_F_3.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(15) "UJA1169ATK/X/FZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "19.620160" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(29) "IC MINI-CAN SYSTEM BASIS CHIP" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["yy"]=> string(18) "系统基础芯片" ["jk"]=> string(9) "CAN，SPI" ["dydy"]=> string(8) "3V ~ 28V" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-VFDFN 裸露焊盘" ["gysqjfz"]=> string(21) "20-HVSON（3.5x5.5）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> NULL ["gl_gnd"]=> NULL ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> NULL ["cat_id"]=> string(2) "20" ["wl_num"]=> string(4) "1076" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(11) "golon_jk_zy" ["ch_bm"]=> string(18) "专用接口芯片" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1630395667" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1076" ["parent_id"]=> string(2) "19" ["lb"]=> string(26) "接口 专用接口芯片" ["action_name"]=> string(2) "j1" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： UJA1169ATK/X/FZ复制
状态： 在售 修改
品牌： NXP/恩智浦复制
封装：20-HVSON（3.5x5.5）
外壳：20-VFDFN 裸露焊盘
描述： IC MINI-CAN SYSTEM BASIS CHIP
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 4520 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，SPI
电压-电源输入(V)：3V ~ 28V
工作温度：-
丝印：(请登录)
料号：10764520
5+: ￥27.57
3000+: ￥20.70
起订量:5 修改
包装量: 3000个/ 卷带 修改
个
总额：
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'UJA1169ATK/X/FZ' ) LIMIT 1

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