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array(66) { ["id"]=> string(4) "1166" ["pdf_add"]=> string(71) "http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en584624" ["images_sw"]=> string(1) " " ["images_mk"]=> string(81) "https://media.digikey.com/Renders/Microchip%20Tech%20Renders/150;C04-377;;169.jpg" ["images"]=> string(93) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microchip_Tech_Renders/150;C04-377;;169.jpg" ["ljbh"]=> string(12) "HV583GA-G-ND" ["zzsbh"]=> string(9) "HV583GA-G" ["zddgs"]=> string(1) "1" ["xysl"]=> string(3) "317" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(28) "IC 128BIT SHIFT REG 169TFBGA" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["ljlx"]=> string(15) "移位寄存器" ["sclx"]=> string(9) "推挽式" ["yjs"]=> string(1) "4" ["myjws"]=> string(2) "32" ["gn"]=> string(15) "串行至并行" ["dydy"]=> string(11) "4.5V ~ 5.5V" ["gzwd"]=> string(15) "-25°C ~ 125°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(9) "169-TFBGA" ["gysqjfz"]=> string(20) "169-TFBGA（10x10）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(3) "184" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "169" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "70" ["wl_num"]=> string(4) "1122" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_lj_wyjcq" ["ch_bm"]=> string(23) "移位寄存器(逻辑)" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_lj_wyjcq' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1122" ["parent_id"]=> string(2) "62" ["lb"]=> string(31) "逻辑 移位寄存器(逻辑)" ["action_name"]=> string(2) "l8" ["rate"]=> string(5) "1.049" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.3990" } }
型号： HV583GA-G复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：169-TFBGA（10x10）
外壳：169-TFBGA
描述： IC 128BIT SHIFT REG 169TFBGA
SELECT * FROM `golon_lj_wyjcq` WHERE ( `id` = 1166 ) LIMIT 1
系列：
逻辑类型：移位寄存器
输出类型：推挽式
元件数：4
每元件位数：32
功能：串行至并行
电压-电源(vin)：4.5V ~ 5.5V
工作温度：-25°C ~ 125°C
丝印：(请登录)
料号：11221166
量大可议价
起订量:5 修改
包装量: 184个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'HV583GA-G' ) LIMIT 1
array(66) { ["id"]=> string(4) "1168" ["pdf_add"]=> string(71) "http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en584621" ["images_sw"]=> string(1) " " ["images_mk"]=> string(81) "https://media.digikey.com/Renders/Microchip%20Tech%20Renders/150;C04-377;;169.jpg" ["images"]=> string(93) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microchip_Tech_Renders/150;C04-377;;169.jpg" ["ljbh"]=> string(12) "HV582GA-G-ND" ["zzsbh"]=> string(9) "HV582GA-G" ["zddgs"]=> string(1) "1" ["xysl"]=> string(3) "504" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(32) "IC 96BIT SHIFT REGISTER 169TFBGA" ["xl"]=> string(0) "" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(16) "Microchip/微芯" ["zzs_old"]=> string(20) "Microchip Technology" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["ljlx"]=> string(15) "移位寄存器" ["sclx"]=> string(9) "推挽式" ["yjs"]=> string(1) "6" ["myjws"]=> string(2) "16" ["gn"]=> string(15) "串行至并行" ["dydy"]=> string(11) "4.5V ~ 5.5V" ["gzwd"]=> string(15) "-40°C ~ 125°C" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(9) "169-TFBGA" ["gysqjfz"]=> string(20) "169-TFBGA（10x10）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(3) "184" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "169" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "70" ["wl_num"]=> string(4) "1122" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_lj_wyjcq" ["ch_bm"]=> string(23) "移位寄存器(逻辑)" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_lj_wyjcq' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1122" ["parent_id"]=> string(2) "62" ["lb"]=> string(31) "逻辑 移位寄存器(逻辑)" ["action_name"]=> string(2) "l8" ["rate"]=> string(5) "1.049" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.3990" } }
型号： HV582GA-G复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：169-TFBGA（10x10）
外壳：169-TFBGA
描述： IC 96BIT SHIFT REGISTER 169TFBGA
SELECT * FROM `golon_lj_wyjcq` WHERE ( `id` = 1168 ) LIMIT 1
系列：
逻辑类型：移位寄存器
输出类型：推挽式
元件数：6
每元件位数：16
功能：串行至并行
电压-电源(vin)：4.5V ~ 5.5V
工作温度：-40°C ~ 125°C
丝印：(请登录)
料号：11221168
量大可议价
起订量:5 修改
包装量: 184个/ 托盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'HV582GA-G' ) LIMIT 1

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