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array(66) { ["id"]=> string(3) "161" ["pdf_add"]=> string(85) "http://media.digikey.com/pdf/Data%20Sheets/ST%20Microelectronics%20PDFS/STA333SML.pdf" ["images_sw"]=> string(1) " " ["images_mk"]=> string(67) "//media.digikey.com/Renders/STMicro%20Renders/30-WFBGA,%20FCBGA.jpg" ["images"]=> string(67) "//media.digikey.com/Renders/STMicro%20Renders/30-WFBGA,%20FCBGA.jpg" ["ljbh"]=> string(12) "STA333SML-ND" ["zzsbh"]=> string(9) "STA333SML" ["zddgs"]=> string(4) "5000" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(31) "IC FULLY INTEG PROC FLIPCHIP 30" ["xl"]=> string(17) "Sound Terminal™" ["zzs"]=> string(18) "ST/意法半导体" ["zzs_new"]=> string(18) "ST/意法半导体" ["zzs_old"]=> string(18) "STMicroelectronics" ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["gn"]=> string(18) "全集成处理器" ["yy"]=> string(15) "前置放大器" ["tds"]=> string(1) "2" ["jk"]=> string(4) "I²S" ["dydy"]=> string(10) "4.5V ~ 18V" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["azlx"]=> string(15) "表面贴装型" ["gg"]=> string(15) "全柔性放大" ["fz_wk"]=> string(16) "30-WFBGA，FCBGA" ["gysqjfz"]=> string(9) "覆晶 30" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(0) "" ["spq"]=> string(1) "-" ["moq"]=> string(1) "-" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "30" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "79" ["wl_num"]=> string(4) "1062" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(10) "golon_ypzy" ["ch_bm"]=> string(12) "专用音频" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ypzy' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1062" ["parent_id"]=> string(2) "78" ["lb"]=> string(26) "音频专用 专用音频" ["action_name"]=> string(2) "y1" ["rate"]=> string(5) "1.096" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.5760" } }
型号： STA333SML复制
状态： 在售 修改
品牌： ST/意法半导体复制
封装：覆晶 30
外壳：30-WFBGA，FCBGA
描述： IC FULLY INTEG PROC FLIPCHIP 30
SELECT * FROM `golon_ypzy` WHERE ( `id` = 161 ) LIMIT 1
功能：全集成处理器
应用：前置放大器
通道数：2
接口：I²S
电源电压(V)：4.5V ~ 18V
工作温度：0°C ~ 70°C（TA）
类别： 专用音频
丝印：(请登录)
料号：1062161
量大可议价
参考价: array(5) { ["count"]=> string(1) "0" ["gys_id"]=> NULL ["zzsbh"]=> NULL ["price"]=> NULL ["show_price"]=> NULL }
起订量:- 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'STA333SML' ) LIMIT 1
array(73) { ["id"]=> string(4) "7663" ["pdf_add"]=> string(150) "http://www.st.com/content/ccc/resource/technical/document/datasheet/f2/66/03/b6/d9/c6/44/13/CD00241001.pdf/files/CD00241001.pdf/jcr:content/translatio" ["images_sw"]=> string(1) " " ["images_mk"]=> string(67) "//media.digikey.com/Renders/STMicro%20Renders/30-WFBGA,%20FCBGA.jpg" ["images"]=> string(85) "https://www.chenkeiot.com/Public/imagesmk/Renders/STMicro_Renders/30-WFBGA,_FCBGA.jpg" ["ljbh"]=> string(14) "497-11973-2-ND" ["zzsbh"]=> string(10) "STG3820BJR" ["zddgs"]=> string(4) "5000" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC SWITCH QUAD DPDT 30FLIPCHIP" ["xl"]=> string(0) "" ["zzs"]=> string(18) "ST/意法半导体" ["zzs_new"]=> string(18) "ST/意法半导体" ["zzs_old"]=> string(18) "STMicroelectronics" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["kgdl"]=> string(4) "DPDT" ["dlfyq_jfyqdl"]=> string(5) "2：2" ["dls"]=> string(1) "4" ["dtdz_max"]=> string(10) "5.8 欧姆" ["td_td"]=> string(10) "300 毫欧" ["dydy_d"]=> string(12) "1.65V ~ 4.3V" ["dydy_s"]=> string(1) "-" ["kgsj_max"]=> string(11) "15ns，13ns" ["kd"]=> string(6) "800MHz" ["dhzr"]=> string(5) "6.4pC" ["gddr"]=> string(3) "2pF" ["dl_lx_max"]=> string(4) "20nA" ["cr"]=> string(12) "-78dB @ 1MHz" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(16) "30-WFBGA，FCBGA" ["gysqjfz"]=> string(9) "覆晶 30" ["djs"]=> string(1) "-" ["bz"]=> string(6) "卷盘" ["spq"]=> string(4) "5000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["tag"]=> string(1) " " ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "30" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "3" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "28" ["wl_num"]=> string(4) "1084" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(23) "golon_jk_mlkg_dlfy_dlfj" ["ch_bm"]=> string(38) "模拟开关,多路复用器/分解器" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_mlkg_dlfy_dlfj' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1084" ["parent_id"]=> string(2) "19" ["lb"]=> string(46) "接口 模拟开关,多路复用器/分解器" ["action_name"]=> string(2) "j9" ["rate"]=> string(5) "1.055" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4050" } }
型号： STG3820BJR复制
状态： 在售 修改
品牌： ST/意法半导体复制
封装：覆晶 30
外壳：30-WFBGA，FCBGA
描述： IC SWITCH QUAD DPDT 30FLIPCHIP
SELECT * FROM `golon_jk_mlkg_dlfy_dlfj` WHERE ( `id` = 7663 ) LIMIT 1
开关电路：DPDT
多路复用器/解复用器电路：2：2
电路数：4
导通电阻(最大值)：5.8 欧姆
电压-电源,单(v+)：1.65V ~ 4.3V
电压-电源,双(v±)：-
开关时间(Ton,Tof/最大值）：15ns，13ns
-db带宽：800MHz
丝印：(请登录)
料号：10847663
量大可议价
起订量:5 修改
包装量: 5000个/ 卷盘 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'STG3820BJR' ) LIMIT 1

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